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High spatial resolution grain orientation and strain mapping in thin films using polychromatic submicron x-ray diffraction
Author(s) -
Nobumichi Tamura,
Alastair A. MacDowell,
Richard Celestre,
H. A. Padmore,
B. C. Valek,
J. C. Bravman,
Ralph Spolenak,
W. L. Brown,
T. Marieb,
H. Fujimoto,
B. W. Batterman,
J. R. Patel
Publication year - 2002
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.1477621
Subject(s) - achromatic lens , materials science , synchrotron radiation , synchrotron , optics , thin film , image resolution , crystallite , microstructure , diffraction , x ray crystallography , optoelectronics , nanotechnology , composite material , physics , metallurgy
The availability of high brilliance synchrotron sources, coupled with recent progress in achromatic focusing optics and large area 2D detector technology, have allowed us to develop an X-ray synchrotron technique capable of mapping orientation and strain/stress in polycrystalline thin films with submicron spatial resolution. To demonstrate the capabilities of this instrument, we have employed it to study the microstructure of aluminum thin film structures at the granular and subgranular level. Owing to the relatively low absorption of X-rays in materials, this technique can be used to study passivated samples, an important advantage over most electron probes given the very different mechanical behavior of buried and unpassivated materials

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