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Response to “Comment on ‘Effect of current crowding on vacancy diffusion and void formation in electromigration’ ” [Appl. Phys. Lett. 79, 1061 (2001)]
Author(s) -
K. N. Tu
Publication year - 2001
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.1386625
Subject(s) - electromigration , void (composites) , vacancy defect , current crowding , diffusion , materials science , condensed matter physics , current (fluid) , statistical physics , thermodynamics , physics , composite material

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