Open AccessNanoscale elastic imaging and mechanical modulus measurements of aluminum/low-k dielectric interconnect structures
Author(s) -
Gajendra S. Shekhawat
Publication year - 2001
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.1354440
Subject(s) - materials science , dielectric , elastic modulus , nanoscopic scale , composite material , interconnection , modulus , stress (linguistics) , ultrasonic sensor , acoustic microscopy , aluminium , young's modulus , microscopy , optoelectronics , optics , nanotechnology , acoustics , computer network , linguistics , philosophy , physics , computer science
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