Open AccessPolysilicon chemical-mechanical polishing process characterization using a non-contact capacitance probe technique
Author(s) -
Dale L. Hetherington
Publication year - 2001
Publication title -
aip conference proceedings
Language(s) - Uncategorized
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.1354435
Subject(s) - metrology , materials science , wafer , polishing , chemical mechanical planarization , capacitance , capacitive sensing , characterization (materials science) , ellipsometry , pressure measurement , optoelectronics , composite material , optics , mechanical engineering , electrode , thin film , nanotechnology , computer science , chemistry , physics , engineering , operating system
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