Open AccessResponse to ‘‘Comment on ‘Aluminum cladding of high T c superconductor by thermocompression bonding’ ’’ [Appl. Phys. Lett. 5 5, 321 (1989)]
Author(s) -
Thomas J. Richardson,
Lutgard C. De Jonghe
Publication year - 1989
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.102416
Subject(s) - cladding (metalworking) , aluminium , superconductivity , materials science , condensed matter physics , thermocompression bonding , composite material , physics , thermodynamics , layer (electronics)
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