Open AccessSTUDY OF COPPER-ALUMINA BONDING
Author(s) -
Michel Courbière,
D. Tréheux,
C. Béraud,
C. Esnouf,
G. Thollet,
Gilbert Fantozzi
Publication year - 1986
Publication title -
le journal de physique colloques
Language(s) - English
Resource type - Journals
eISSN - 2777-3418
pISSN - 0449-1947
DOI - 10.1051/jphyscol:1986128
Subject(s) - copper , materials science , metallurgy
Bonding between a metal and a ceramic can be obtained by hot pressing of the two materials under low pressure (< 10 MPa) in protective atmosphere. In the present study this method was used to bond copper with alumina. The interface was assessed mechanically using a shear test as a function of time and copper oxidation. The bonding zone and the failures have been observed and analysed by electron probe microanalysis and transmission electron microscopy
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