Open AccessThermal scanning probe lithography using Parylene C as thermal resist
Author(s) -
Jiang Yun,
Dodds Kevin,
Dunare Camelia,
Lomax Peter,
Cheung Rebecca
Publication year - 2022
Publication title -
micro and nano letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.25
H-Index - 31
ISSN - 1750-0443
DOI - 10.1049/mna2.12111
Subject(s) - resist , parylene , materials science , lithography , fabrication , etching (microfabrication) , thermal , reactive ion etching , photolithography , photoresist , nanotechnology , substrate (aquarium) , layer (electronics) , optoelectronics , composite material , polymer , physics , pathology , meteorology , oceanography , geology , medicine , alternative medicine
Thermal scanning probe lithography is a direct‐write patterning method that uses a heated scanning probe tip to remove thermal resist. The most widely used thermal resist is polyphthalaldehyde. Another alternative thermal resist, Parylene C is introduced in this letter. It has been found that Parylene C has a wide process latitude as a thermal resist under our experimental conditions. A high resolution of ∼40 nm can be achieved in our optimised process. In addition, patterns in parylene layer can be transferred directly into the substrate with deep reactive ion etching without an additional hard mask, thus simplifying the fabrication process.