z-logo
open-access-imgOpen Access
Applications of thermodynamic calculations to practical TEG design: Mg2(Si0.3Sn0.7)/Cu interconnections
Author(s) -
Silvana Tumminello,
Sahar Ayachi,
Suzana G. Fries,
Eckhard Müller,
Johannes de Boor
Publication year - 2021
Publication title -
journal of materials chemistry. a
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.637
H-Index - 212
eISSN - 2050-7488
pISSN - 2050-7496
DOI - 10.1039/d1ta05289f
Subject(s) - thermodynamics , materials science , physics
Mg 2 (Si 0.3 Sn 0.7 )/Cu contact couple was selected to illustrate that equilibrium thermodynamic considerations are an efficient support to anticipate/identify reaction products in the bonded region, and ultimately, for improving the contact design.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here