
Applications of thermodynamic calculations to practical TEG design: Mg2(Si0.3Sn0.7)/Cu interconnections
Author(s) -
Silvana Tumminello,
Sahar Ayachi,
Suzana G. Fries,
Eckhard Müller,
Johannes de Boor
Publication year - 2021
Publication title -
journal of materials chemistry. a
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.637
H-Index - 212
eISSN - 2050-7488
pISSN - 2050-7496
DOI - 10.1039/d1ta05289f
Subject(s) - thermodynamics , materials science , physics
Mg 2 (Si 0.3 Sn 0.7 )/Cu contact couple was selected to illustrate that equilibrium thermodynamic considerations are an efficient support to anticipate/identify reaction products in the bonded region, and ultimately, for improving the contact design.