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Nucleation of copper on mild steel in copper chloride (CuCl2·2H2O)–1-ethyl-3-methylimidazolium chloride [EMIM]Cl–ethylene glycol (EG) ionic liquid
Author(s) -
Gengan Saravanan,
Subramanian Mohan
Publication year - 2013
Publication title -
new journal of chemistry
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.693
H-Index - 122
eISSN - 1369-9261
pISSN - 1144-0546
DOI - 10.1039/c3nj00245d
Subject(s) - chemistry , ionic liquid , chronoamperometry , copper , nucleation , ethylene glycol , chloride , cyclic voltammetry , inorganic chemistry , electrolyte , supporting electrolyte , electrochemistry , organic chemistry , electrode , catalysis
A dense and adhesive Cu layer was successfully electrodeposited on mild steel in a copper chloride (CuCl2·2H2O)–1-ethyl-3-methylimidazolium chloride [EMIM]Cl–ethylene glycol [EG] ionic liquid. The mechanism of copper nucleation is studied using cyclic voltammetry and chronoamperometry. It is observed that 3D-instantaneous nucleation leads to a bright nano-structured deposit. The morphology of the deposit was characterized SEM and X-ray diffraction techniques. The deposition method was found to take place in an environmentally friendly green electrolyte without co-ligands such as cyanide and volatile toxic solvents.

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