Open AccessPolymeric Materials for Electronics Packaging and Interconnection
Author(s) -
J. H. Lupinski,
Robert Moore
Publication year - 1989
Publication title -
acs symposium series
Language(s) - English
Resource type - Book series
SCImago Journal Rank - 0.169
H-Index - 64
eISSN - 1947-5918
pISSN - 0097-6156
DOI - 10.1021/bk-1989-0407.ch001
Subject(s) - interconnection , electronics , emphasis (telecommunications) , plastic packaging , electronic packaging , materials science , integrated circuit packaging , nanotechnology , manufacturing engineering , engineering , electrical engineering , mechanical engineering , telecommunications , integrated circuit
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