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Introduction of TiO2 in CuI for Its Improved Performance as a p-Type Transparent Conductor
Author(s) -
Vidur Raj,
Teng Lü,
Mark Lockrey,
Rong Liu,
Felipe Kremer,
Li Li,
Yun Liu,
Hark Hoe Tan,
C. Jagadish
Publication year - 2019
Publication title -
acs applied materials and interfaces
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.535
H-Index - 228
eISSN - 1944-8252
pISSN - 1944-8244
DOI - 10.1021/acsami.9b05566
Subject(s) - materials science , conductor , type (biology) , optoelectronics , electrical conductor , engineering physics , nanotechnology , composite material , engineering , ecology , biology
The challenges of making high-performance, low-temperature processed, p-type transparent conductors (TCs) have been the main bottleneck for the development of flexible transparent electronics. Though a few p-type transparent conducting oxides (TCOs) have shown promising results, they need high processing temperature to achieve the required conductivity which makes them unsuitable for organic and flexible electronic applications. Copper iodide is a wide band gap p-type semiconductor that can be heavily doped at low temperature (<100 °C) to achieve conductivity comparable or higher than many of the well-established p-type TCOs. However, as-processed CuI loses its transparency and conductivity with time in an ambient condition which makes them unsuitable for long-term applications. Herein, we propose CuI-TiO 2 composite thin films as a replacement of pure CuI. We show that the introduction of TiO 2 in CuI makes it more stable in ambient conditions while also improving its conductivity and transparency. A detailed comparative analysis between CuI and CuI-TiO 2 composite thin films has been performed to understand the reasons for improved conductivity, transparency, and stability of CuI-TiO 2 samples in comparison to pure CuI samples. The enhanced conductivity in CuI-TiO 2 stems from the highly conductive space-charge layer formation at the CuI-TiO 2 interface, whereas the improved transparency is due to reduced CuI grain growth mobility in the presence of TiO 2 . The improved stability of CuI-TiO 2 in comparison to pure CuI is a result of inhibited recrystallization and grain growth, reduced loss of iodine, and limited oxidation of the CuI phase in the presence of TiO 2 . For optimized fraction of TiO 2 , an average transparency of ∼78% (in 450-800 nm region) and a resistivity of 14 mΩ·cm are achieved, while maintaining a relatively high mobility of ∼3.5 cm 2 V -1 s -1 with hole concentration reaching as high as 1.3 × 10 20 cm -3 . Most importantly, this work opens up the possibility to design a new range of p-type transparent conducting materials using the CuI/insulator composite system such as CuI/SiO 2 , CuI/Al 2 O 3 , CuI/SiN x , and so forth.

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