Complete Strain Mapping of Nanosheets of Tantalum Disulfide
Author(s) -
Yue Cao,
Tadesse A. Assefa,
Soham Banerjee,
Andrew Wieteska,
Dennis Zi-Ren Wang,
Abhay N. Pasupathy,
Xiao Tong,
Yu Liu,
W. J. Lu,
Yuping Sun,
Yan He,
Xiaojing Huang,
Hanfei Yan,
Yong S. Chu,
Simon J. L. Billinge,
Ian Robinson
Publication year - 2020
Publication title -
acs applied materials and interfaces
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.535
H-Index - 228
eISSN - 1944-8252
pISSN - 1944-8244
DOI - 10.1021/acsami.0c06517
Subject(s) - materials science , diffraction , characterization (materials science) , synchrotron , image resolution , strain (injury) , tantalum , crystal (programming language) , electronics , nanotechnology , optics , optoelectronics , metallurgy , medicine , chemistry , physics , computer science , programming language
Quasi-two-dimensional (quasi-2D) materials hold promise for future electronics because of their unique band structures that result in electronic and mechanical properties sensitive to crystal strains in all three dimensions. Quantifying crystal strain is a prerequisite to correlating it with the performance of the device and calls for high resolution but spatially resolved rapid characterization methods. Here, we show that using fly-scan nano X-ray diffraction, we can accomplish a tensile strain sensitivity below 0.001% with a spatial resolution of better than 80 nm over a spatial extent of 100 μm on quasi-2D flakes of 1T-TaS 2 . Coherent diffraction patterns were collected from a ∼100 nm thick sheet of 1T-TaS 2 by scanning a 12 keV focused X-ray beam across and rotating the sample. We demonstrate that the strain distribution around micron- and submicron-sized "bubbles" that are present in the sample may be reconstructed from these images. The experiments use state-of-the-art synchrotron instrumentation and will allow rapid and nonintrusive strain mapping of thin-film samples and electronic devices based on quasi-2D materials.
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