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A Correlative Study of Interfacial Segregation in a Cu-Doped TiNiSn Thermoelectric half-Heusler Alloy
Author(s) -
John Halpin,
Benjamin M. Jenkins,
Michael P. Moody,
Robert W. H. Webster,
JanWillem G. Bos,
Paul A.J. Bagot,
Donald A. MacLaren
Publication year - 2022
Publication title -
acs applied electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.379
H-Index - 4
ISSN - 2637-6113
DOI - 10.1021/acsaelm.2c00699
Subject(s) - grain boundary , materials science , atom probe , thermoelectric effect , microstructure , thermoelectric materials , crystallite , crystallography , impurity , oxide , alloy , dopant , condensed matter physics , doping , chemical physics , metallurgy , composite material , chemistry , thermodynamics , thermal conductivity , physics , organic chemistry , optoelectronics

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