Open AccessControlling Interfacial Exchanges in Liquid Phase Bonding Enables Formation of Strong and Reliable Cu–Sn Soldering for High-Power and Temperature Applications
Author(s) -
JeanFrançois Silvain,
Loïc Constantin,
JeanMarc Heintz,
S. Bordère,
Lionel TeuléGay,
Yongfeng Lu,
Jean-Luc Diot,
Renaud de Langlade,
Emilien Feuillet
Publication year - 2021
Publication title -
acs applied electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.379
H-Index - 4
ISSN - 2637-6113
DOI - 10.1021/acsaelm.0c01040
Subject(s) - soldering , materials science , temperature cycling , composite material , phase (matter) , dissolution , layer (electronics) , shear stress , metallurgy , thermal , chemical engineering , thermodynamics , chemistry , physics , organic chemistry , engineering
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