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Strain-Dependent Edge Structures in MoS2 Layers
Author(s) -
Miguel Tinoco,
Louis Maduro,
Masaki Mukai,
Eiji Okunishi,
Sònia Conesa-Boj
Publication year - 2017
Publication title -
nano letters
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 4.853
H-Index - 488
eISSN - 1530-6992
pISSN - 1530-6984
DOI - 10.1021/acs.nanolett.7b03627
Subject(s) - zigzag , materials science , enhanced data rates for gsm evolution , curvature , electronic structure , transmission electron microscopy , scanning transmission electron microscopy , condensed matter physics , electron energy loss spectroscopy , strain (injury) , nanotechnology , geometry , physics , computer science , mathematics , medicine , telecommunications
Edge structures are low-dimensional defects unavoidable in layered materials of the transition metal dichalcogenides (TMD) family. Among the various types of such structures, the armchair (AC) and zigzag (ZZ) edge types are the most common. It has been predicted that the presence of intrinsic strain localized along these edges structures can have direct implications for the customization of their electronic properties. However, pinning down the relation between local structure and electronic properties at these edges is challenging. Here, we quantify the local strain field that arises at the edges of MoS 2 flakes by combining aberration-corrected transmission electron microscopy (TEM) with the geometrical-phase analysis (GPA) method. We also provide further insight on the possible effects of such edge strain on the resulting electronic behavior by means of electron energy loss spectroscopy (EELS) measurements. Our results reveal that the two-dominant edge structures, ZZ and AC, induce the formation of different amounts of localized strain fields. We also show that by varying the free edge curvature from concave to convex, compressive strain turns into tensile strain. These results pave the way toward the customization of edge structures in MoS 2 , which can be used to engineer the properties of layered materials and thus contribute to the optimization of the next generation of atomic-scale electronic devices built upon them.

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