Low Temperature Scalable Deposition of Copper(I) Thiocyanate Films via Aerosol-Assisted Chemical Vapor Deposition | Zendy

Lokeshwari Mohan | Zendy; Sinclair R. Ratnasingham | Zendy; Julianna Panidi | Zendy; Thomas D. Anthopoulos | Zendy; Russell Binions | Zendy; Martyn A. McLachlan | Zendy; Joe Briscoe | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Open Access

Low Temperature Scalable Deposition of Copper(I) Thiocyanate Films via Aerosol-Assisted Chemical Vapor Deposition

Author(s) -

Lokeshwari Mohan,

Sinclair R. Ratnasingham,

Julianna Panidi,

Thomas D. Anthopoulos,

Russell Binions,

Martyn A. McLachlan,

Joe Briscoe

Publication year - 2020

Publication title -

crystal growth and design

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.966

H-Index - 155

eISSN - 1528-7505

pISSN - 1528-7483

DOI - 10.1021/acs.cgd.0c00605

Subject(s) - chemical vapor deposition , thin film , deposition (geology) , band gap , materials science , volumetric flow rate , copper , combustion chemical vapor deposition , thiocyanate , analytical chemistry (journal) , chemical engineering , optoelectronics , nanotechnology , chemistry , inorganic chemistry , carbon film , metallurgy , organic chemistry , paleontology , physics , quantum mechanics , sediment , engineering , biology

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Accelerating Research