Implicit integration scheme for porous viscoplastic potential-based constitutive equations | Zendy

Sabeur Msolli | Zendy; Olivier Dalverny | Zendy; Joël Alexis | Zendy; Moussa Karama | Zendy

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Implicit integration scheme for porous viscoplastic potential-based constitutive equations

Author(s) -

Sabeur Msolli,

Olivier Dalverny,

Joël Alexis,

Moussa Karama

Publication year - 2011

Publication title -

procedia engineering

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.32

H-Index - 74

ISSN - 1877-7058

DOI - 10.1016/j.proeng.2011.04.258

Subject(s) - viscoplasticity , constitutive equation , materials science , creep , coalescence (physics) , isotropy , hardening (computing) , porosity , mechanics , porous medium , structural engineering , composite material , finite element method , engineering , physics , layer (electronics) , quantum mechanics , astrobiology

This paper deals with a viscoplastic potential-based model allowing thermomechanical damage behavior modeling of porous materials. The model describes rate dependent effects, hardening, creep as well as defects coalescence and propagation. Kinematic and isotropic hardening effects are taken into account by a set of internal state variables. The integration and implementation of the model into the FE code using a fully implicit integration scheme is exposed. Finally, it 19s used to predict mechanical behaviour degradation of solder layers used in power electronic packaging. Stress-strain behaviour and the evolution of volumic fraction of voids for the material under cyclic loading are presented

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