Strength Analysis for the Adhesive Layer on the Basis of Intensity of Singular Stress | Zendy

N. Noda | Zendy; Yu Zhang | Zendy; Xin Lan | Zendy; Ken-Tarou Takaisi | Zendy

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Strength Analysis for the Adhesive Layer on the Basis of Intensity of Singular Stress

Author(s) -

N. Noda,

Yu Zhang,

Xin Lan,

Ken-Tarou Takaisi

Publication year - 2011

Publication title -

procedia engineering

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.32

H-Index - 74

ISSN - 1877-7058

DOI - 10.1016/j.proeng.2011.04.120

Subject(s) - adhesive , materials science , joint (building) , stress intensity factor , composite material , finite element method , stress (linguistics) , bending , structural engineering , layer (electronics) , stress concentration , enhanced data rates for gsm evolution , tension (geology) , basis (linear algebra) , fracture mechanics , ultimate tensile strength , mathematics , computer science , geometry , engineering , telecommunications , linguistics , philosophy

In this paper the strength of adhesive joint under tension and bending is discussed on the basis of intensity of singular stress by the application of FEM. A useful method is presented with focusing on the stress at the edge of interface between the adhesive and adherent obtained by FEM. After analyzing the adhesive joint strength with all material combinations, it is found that to improve the interface strength, thin adhesive layers are desirable because the intensity of singular stress decreases with decreasing of the thickness.11th International Conference on the mechanical behavior of Materials (ICM11), 5-9 June 2011, Como, Ital

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