Open AccessSoftware reliability prediction using package level modularization metrics
Author(s) -
Camelia Şerban,
Mohsin Shaikh
Publication year - 2020
Publication title -
procedia computer science
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.334
H-Index - 76
ISSN - 1877-0509
DOI - 10.1016/j.procs.2020.09.086
Subject(s) - computer science , modular programming , reliability (semiconductor) , software , software package , reliability engineering , software engineering , software quality , programming language , software development , power (physics) , physics , quantum mechanics , engineering
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