Large-Area Laser-Lift-Off Processing in Microelectronics | Zendy

Ralph Delmdahl | Zendy; Rainer Pätzel | Zendy; Jan Brune | Zendy

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Large-Area Laser-Lift-Off Processing in Microelectronics

Author(s) -

Ralph Delmdahl,

Rainer Pätzel,

Jan Brune

Publication year - 2013

Publication title -

physics procedia

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.26

H-Index - 61

ISSN - 1875-3892

DOI - 10.1016/j.phpro.2013.03.075

Subject(s) - microelectronics , materials science , laser , optoelectronics , excimer laser , transistor , lift (data mining) , diode , thin film transistor , polymer , nanotechnology , optics , computer science , layer (electronics) , electrical engineering , composite material , physics , voltage , data mining , engineering

Laser lift-off is an enabling technology for microelectronics growth markets such as light emitting diodes, densely packaged semiconductor devices, and flexible displays. For example, thin film transistor structures fabricated on top of polymer layers spun on glass carriers must be delaminated from rigid substrates to create lightweight and rugged flexible displays on polymers. Low-thermal-budget processes are generically required to protect adjacent functional films. Excimer lasers provide short UV wavelength and short pulse duration required for highly-localized energy coupling. The high output power of excimer lasers enables a large processing footprint and the high-throughput rates needed in mass manufacturing

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