SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades | Zendy

A. Macchiolo | Zendy; L. Andricek | Zendy; H.-G. Moser | Zendy; R. Nisius | Zendy; Rainer Richter | Zendy; P. Weigell | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Open Access

SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades

Author(s) -

A. Macchiolo,

L. Andricek,

H.-G. Moser,

R. Nisius,

Rainer Richter,

P. Weigell

Publication year - 2012

Publication title -

physics procedia

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.26

H-Index - 61

ISSN - 1875-3892

DOI - 10.1016/j.phpro.2012.02.444

Subject(s) - chip , atlas (anatomy) , pixel , process (computing) , materials science , computer science , detector , embedded system , computer hardware , telecommunications , geology , operating system , artificial intelligence , paleontology

We present the results of the characterization of pixel modules composed of 75μm thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at Fraunhofer-EMFT, is explored as an alternative to the bump-bonding process. These modules have been designed to demonstrate the feasibility of a very compact detector to be employed in the future ATLAS pixel upgrades, making use of vertical integration technologies. This module concept also envisages Inter-Chip-Vias (ICV) to extract the signals from the backside of the chips, thereby achieving a higher fraction of active area with respect to the present pixel module design. In the case of the demonstrator module, ICVs are etched over the original wire bonding pads of the FE-I3 chip. In the modules with ICVs the FE-I3 chips will be thinned down to 50 um. The status of the ICV preparation is presented

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Accelerating Research