Fabrication of thermoformable circuits by laser patterning of metallized thermoplastic foils | Zendy

Bodo Wojakowski | Zendy; Ulrich Klug | Zendy; Jan Düsing | Zendy; Rainer Kling | Zendy

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Fabrication of thermoformable circuits by laser patterning of metallized thermoplastic foils

Author(s) -

Bodo Wojakowski,

Ulrich Klug,

Jan Düsing,

Rainer Kling

Publication year - 2010

Publication title -

physics procedia

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.26

H-Index - 61

ISSN - 1875-3892

DOI - 10.1016/j.phpro.2010.08.150

Subject(s) - materials science , deep drawing , thermoplastic , fabrication , laser , interconnection , composite material , sheet metal , optoelectronics , electronic circuit , optics , computer science , electrical engineering , medicine , alternative medicine , physics , pathology , engineering , computer network

High-resolution laser patterning offers innovative methods for the manufacturing of threedimensional interconnect devices. The process chain presented in this paper uses cost efficient metal thin-films sputtered on thermoplastic sheets and two-dimensional high speed laserprocessing, whereas the three-dimensional shape of the end product is realized by deep drawing of the machined sheet. Due to the lower fracture strain of metals in comparison to thermoplastics extensive fragmentation of the deposited metal film occurs during deep drawing; therefore picosecond laser fine structuring is used to provide strain relief in the circuitry and to preserve the conductivity after the drawing process

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