Influence of deformation temperature on the microstructure and thermal stability of HPT-consolidated Cu-1%Nb alloys | Zendy

Depeng Shen | Zendy; Hongbo Zhou | Zendy; W.P. Tong | Zendy

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Influence of deformation temperature on the microstructure and thermal stability of HPT-consolidated Cu-1%Nb alloys

Author(s) -

Depeng Shen,

Hongbo Zhou,

W.P. Tong

Publication year - 2019

Publication title -

journal of materials research and technology

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.832

H-Index - 44

eISSN - 2214-0697

pISSN - 2238-7854

DOI - 10.1016/j.jmrt.2019.09.054

Subject(s) - materials science , microstructure , annealing (glass) , thermal stability , alloy , metallurgy , ultimate tensile strength , electrical resistivity and conductivity , thermal conductivity , composite material , chemical engineering , electrical engineering , engineering

Ultrafine grained Cu–Nb alloys with minimal additions of 1 wt.% Nb were prepared by using HPT at ambient temperature (˜20 °C) and elevated temperature (˜200 °C). The microstructure, thermal stability and properties were investigated. The results indicated that compared with the Cu-1%Nb alloy processed at ambient temperature, the sample processed at 200 °C shows higher density and higher thermal stability, which contributed to its higher electrical conductivity and tensile strength after annealing treatment.

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