Work softening behavior of Cu–Cr–Ti–Si alloy during cold deformation | Zendy

Jihui Yuan | Zendy; Liukui Gong | Zendy; Wenqin Zhang | Zendy; Bin Zhang | Zendy; Haigen Wei | Zendy; Xiangpeng Xiao | Zendy; Hang Wang | Zendy; Bin Yang | Zendy

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Work softening behavior of Cu–Cr–Ti–Si alloy during cold deformation

Author(s) -

Jihui Yuan,

Liukui Gong,

Wenqin Zhang,

Bin Zhang,

Haigen Wei,

Xiangpeng Xiao,

Hang Wang,

Bin Yang

Publication year - 2019

Publication title -

journal of materials research and technology

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.832

H-Index - 44

eISSN - 2214-0697

pISSN - 2238-7854

DOI - 10.1016/j.jmrt.2019.01.012

Subject(s) - materials science , softening , alloy , electron backscatter diffraction , dislocation , work hardening , microstructure , transmission electron microscopy , metallurgy , deformation (meteorology) , diffraction , hardening (computing) , copper , composite material , crystallography , optics , nanotechnology , physics , layer (electronics) , chemistry

Work hardening is a common method of strengthening copper-based alloys. However, softening behavior is observed in Cu–Cr–Ti–Si alloy during cold rolling processes. Cold deformation greater than 85% can induce softening behavior. We used an electron backscatter diffraction system, X-ray diffraction, and transmission electron microscopy to analyze the microstructure of alloy samples subjected to different degrees of cold deformation. A greater proportion of high-angle grain boundaries, a lower dislocation density, and certain dislocation configurations indicated that the recovery takes place during heavy cold deformation leading to softening phenomenon.

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