Novel Low-Temperature-Sintering Type Cu-Alloy Pastes for Silicon Solar Cells | Zendy

Manabu Yoshida | Zendy; Hideo Tokuhisa | Zendy; Uichi Itoh | Zendy; Toshihide Kamata | Zendy; Isao Sumita | Zendy; Shigenobu Sekine | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Open Access

Novel Low-Temperature-Sintering Type Cu-Alloy Pastes for Silicon Solar Cells

Author(s) -

Manabu Yoshida,

Hideo Tokuhisa,

Uichi Itoh,

Toshihide Kamata,

Isao Sumita,

Shigenobu Sekine

Publication year - 2012

Publication title -

energy procedia

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.474

H-Index - 81

ISSN - 1876-6102

DOI - 10.1016/j.egypro.2012.05.009

Subject(s) - materials science , sintering , alloy , silicon , metallurgy , melting point , composite material , contact resistance , layer (electronics)

This paper describes a novel Cu paste for low temperature sintering, which is required to fabricate electrodes on transparent conductive films in heterojunction solar cells. For this, glass-fritless Cu-alloy pastes containing a low melting point alloy (LMPA) were prepared. The pastes were evaluated in terms of printability, contact resistance, line resistance, adhesive property, diffusion of Cu in Si, and oxidation resistance. It was concluded that the pastes could be applicable to silicon solar cells requiring low temperature processes

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Accelerating Research