Indium Hybridization of Large Format TES Bolometer Arrays to Readout Multiplexers for Far-Infrared Astronomy

In our effort to develop large format kilo-pixel arrays of transition edge sensors, we are working toward demonstrating electrical connectivity of a hybridized 32×40 element detector to a NIST multiplexer. The geometry of large-scale arrays that attempt to maintain a high filling factor does not allow for typical fan-out wiring, thus the detector array is hybridized directly to the readout multiplexer. The two parts are bonded together with 10 micron tall indium bumps, which complete the electrical path and also provide mechanical strength. The indium hybridization was developed and performed at the Goddard Space Flight Center and has been shown to withstand tensile loading up to 0.26 gram-force per indium bump. A cavity is deep etched behind each pixel prior to bonding, leaving only 30 micron support walls, which maintains a high filling fraction. Electrical continuity has been shown through the indium path in room temperature measurements. We report on the fabrication process used to hybridize the parts and the subsequent electrical performance.