Back-to-back substrate wafer bonding: A new approach to the fabrication of double-side coated wafers | Zendy

P. Kopperschmidt | Zendy; G. Kästner | Zendy; D. Hesse | Zendy; U. Gösele | Zendy; Michael Lorenz | Zendy

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Back-to-back substrate wafer bonding: A new approach to the fabrication of double-side coated wafers

Author(s) -

P. Kopperschmidt,

G. Kästner,

D. Hesse,

U. Gösele,

Michael Lorenz

Publication year - 1997

Publication title -

applied physics a

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.485

H-Index - 149

eISSN - 1432-0630

pISSN - 0947-8396

DOI - 10.1007/s003390050467

Subject(s) - wafer , fabrication , wafer bonding , sapphire , materials science , substrate (aquarium) , optoelectronics , direct bonding , optics , laser , medicine , oceanography , alternative medicine , physics , pathology , geology

. We present a novel method for fabrication of double side coated wafers by back-to-back Direct Wafer Bonding (DWB). Two 3 inch sapphire wafers (R-cut) were coated each with YBaCu O by laser ablation on one side. The wafers were then directly bonded with their uncoated sides together in a microcleanroom. Subsequent heating increased the bond energy up to energies sufficient for fabrication of hybrid devices working at cryogenic temperatures. TEM cross sections reveal direct contact of the two sapphire lattices.

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