Open AccessMatrix laser cleaning: a new technique for the removal of nanometer sized particles from semiconductors
Author(s) -
J. Graf,
Boris Luk‘yanchuk,
M. Mosbacher,
M.H. Hong,
C. T. Chong,
Johannes Boneberg,
P. Leǐderer
Publication year - 2007
Publication title -
applied physics a
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.485
H-Index - 149
eISSN - 1432-0630
pISSN - 0947-8396
DOI - 10.1007/s00339-007-4017-6
Subject(s) - wafer , nanometre , laser , particle (ecology) , materials science , substrate (aquarium) , silicon , matrix (chemical analysis) , dry cleaning , semiconductor , polystyrene , nanotechnology , optoelectronics , optics , composite material , polymer , waste management , physics , oceanography , engineering , geology
In this paper a new laser-based technique for the removal of nanoparticles from silicon wafers, called matrix laser cleaning, is introduced. In contrast to the already existing technique dry laser cleaning damages of the substrate can be avoided. Furthermore no liquids are used, avoiding problems that occur, e.g. in steam laser cleaning and other wet cleaning techniques. We show that damage free particle removal of polystyrene particles with diameters of at least down to 50 nm is possible with a cleaning efficiency very close to 100% within a single shot experiment. Furthermore the cleaning threshold is independent of the particle size.
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