Open AccessIntermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
Author(s) -
TungHan Chuang,
S. F. Yen,
Mingsheng Cheng
Publication year - 2006
Publication title -
journal of electronic materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.422
H-Index - 99
eISSN - 1543-186X
pISSN - 0361-5235
DOI - 10.1007/bf02692450
Subject(s) - intermetallic , ball grid array , soldering , materials science , metallurgy , composite material , shear strength (soil) , reflow soldering , alloy , environmental science , soil science , soil water
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