Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads | Zendy

Chih-Chien Chi | Zendy; TungHan Chuang | Zendy

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Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads

Author(s) -

Chih-Chien Chi,

TungHan Chuang

Publication year - 2006

Publication title -

journal of electronic materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.422

H-Index - 99

eISSN - 1543-186X

pISSN - 0361-5235

DOI - 10.1007/bf02690534

Subject(s) - intermetallic , ball grid array , soldering , materials science , metallurgy , composite material , metallizing , metal , alloy

During the reflow process of Sn-3.5Ag solder ball grid array (BGA) packages with Ag/Cu and Au/Ni/Cu pads, Ag and Au thin films dissolve rapidly into the liquid solder, and the Cu and Ni layers react with the Sn-3.5Ag solder to form Cu6Sn5 and Ni3Sn4 intermetallic compounds at the solder/pad interfaces, respectively. The Cu6Sn5 intermetallic compounds also appear as clusters in the solder matrix of Ag surface-finished packages accompanied by Ag3Sn dispersions. In the solder matrix of Au/Ni surface-finished specimens, Ag3Sn and AuSn4 intermetallics can be observed, and their coarsening coincides progressively with the aging process. The interfacial Cu6Sn5 and Ni3Sn4 intermetallic layers grow by a diffusion-controlled mechanism after aging at 100 and 150C. Ball shear strengths of the reflowed Sn-3.5Ag packages with both surface finishes are similar, displaying the same degradation tendencies as a result of the aging effect.

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