Tin-based reactive solders for ceramic/metal joints | Zendy

Rakesh Kapoor | Zendy; Thomas W. Eagar | Zendy

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Tin-based reactive solders for ceramic/metal joints

Author(s) -

Rakesh Kapoor,

Thomas W. Eagar

Publication year - 1989

Publication title -

metallurgical transactions b

Language(s) - English

Resource type - Journals

eISSN - 2379-0229

pISSN - 0360-2141

DOI - 10.1007/bf02670197

Subject(s) - materials science , tin , liquidus , wetting , ceramic , titanium , metallurgy , titanium nitride , contact angle , titanium alloy , zirconium , silicon nitride , composite material , silicon , alloy , nitride , layer (electronics)

Contact angle measurements on silicon-nitride substrates were conducted on tin-based alloys, containing titanium and zirconium, to determine the suitability of these alloys as filler metals for low-temperature joining of ceramics. Titanium-containing alloys exhibited excellent wettability characterized by contact angles less than 20 deg, whereas the Zr-containing alloys exhibited contact angles around 50 deg. The superior wettability of the Sn−Ti alloys is attributed to the higher activity coefficient of Ti in Sn−Ti alloys. The liquidus temperature of the Sn−Ti alloys is in the 400C to 600C range. Hence, these alloys are expected to reduce the residual stress problem.

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