Surface segregation of boron in dispersion-strengthened copper | Zendy

Dolores GallagherThompson | Zendy; E. W. Hoyt | Zendy; R. E. Kirby | Zendy

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Surface segregation of boron in dispersion-strengthened copper

Author(s) -

Dolores GallagherThompson,

E. W. Hoyt,

R. E. Kirby

Publication year - 1992

Publication title -

journal of materials science

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.813

H-Index - 177

eISSN - 1573-4803

pISSN - 0022-2461

DOI - 10.1007/bf01119762

Subject(s) - materials science , copper , auger electron spectroscopy , x ray photoelectron spectroscopy , brazing , wetting , boron , metallurgy , dispersion (optics) , analytical chemistry (journal) , chemical engineering , composite material , chemistry , physics , organic chemistry , alloy , optics , chromatography , nuclear physics , engineering

The improved yield strength of annealed dispersion-strengthened copper (DSC) over conventional oxygen-free high-conductivity copper makes it a possible candidate for use in extremely high potential gradient particle accelerator structures where stability is of critical importance. Test brazes of such structures show that the surface of DSC is not readily wetted by conventional gold-based braze alloys used for copper. Surface analyses (by X-ray photoelectron spectroscopy and Auger electron spectroscopy) of samples raised to brazing temperature show the presence of boron, which diffuses to the surface and possibly interferes with the wetting process. Boron is an intentional oxygen scavenger added to the DSC during manufacture. Alumina, the primary additive in the strengthening process, is not detected on the surface.

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