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Transmission Laser Welding of Similar and Dissimilar Semiconductor Materials
Author(s) -
Sopeña Pol,
Wang Andong,
Mouskeftaras Alexandros,
Grojo David
Publication year - 2022
Publication title -
laser and photonics reviews
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 3.778
H-Index - 116
eISSN - 1863-8899
pISSN - 1863-8880
DOI - 10.1002/lpor.202200208
Subject(s) - materials science , welding , laser , semiconductor , consumables , semiconductor laser theory , optoelectronics , laser beam welding , gallium arsenide , transmission (telecommunications) , engineering physics , mechanical engineering , optics , computer science , telecommunications , composite material , engineering , physics , marketing , business
Laser micro‐welding is an advanced manufacturing method today applied in various domains. However, important physical limitations have prevented so far to demonstrate its applicability in silicon (Si) and other technology‐essential semiconductors. Concentrating on circumventing the optical limits on the deliverable energy density at interfaces between narrow‐gap materials with intense infrared light, the first feasibility demonstration of transmission laser welding between Si workpieces using nanosecond laser pulses is made. A shear joining strength of 32 ± 10 MPa which compares very favorably to the complex process alternatives is obtained. Supported by experiments repeated on different material combinations including gallium arsenide, it is confirmed that this remarkable performance level is achievable for similar and dissimilar semiconductors. The demonstrations rely on a small footprint fiber laser, an aspect that holds great promises for the advent of a high‐efficiency flexible process beneficial for important technology developments including lab‐on‐a‐chip and hybrid semiconductor systems.