Influence of Cooling Hole Geometry and Material Conductivity on the Thermal Response of Cooled Silicon Nitride Plate | Zendy

Ali AbdulAziz | Zendy; Ramakrishna T. Bhatt | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Open Access

Influence of Cooling Hole Geometry and Material Conductivity on the Thermal Response of Cooled Silicon Nitride Plate

Author(s) -

Ali AbdulAziz,

Ramakrishna T. Bhatt

Publication year - 2008

Publication title -

ceramic engineering and science proceedings

Language(s) - English

Resource type - Book series

SCImago Journal Rank - 0.128

H-Index - 33

eISSN - 1940-6339

pISSN - 0196-6219

DOI - 10.1002/9780470294741.ch15

Subject(s) - thermal conductivity , materials science , silicon nitride , finite element method , thermal , composite material , ceramic , nitride , stress (linguistics) , structural engineering , thermodynamics , engineering , physics , layer (electronics) , linguistics , philosophy

To complement the effectiveness of ceramic materials and their applicability for turbine engine applications, a parametric study using finite element method is carried out. This study tackles thorough analyses of a thermal barrier coated plate specimen with cooling holes made out of Silicon Nitride (Si 3 N 4 ) where its thermal conductivity is varied in an attempt to minimize the thermal stresses and to optimize an ultimate state of stress. The thermal stress profile was generated for circular and square cooling channels. Lower stresses for a higher magnitude of thermal conductivity are reported. Contour plots for the stresses and the temperature are presented and discussed.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Accelerating Research