Growth of Matrix Cracks During Intermediate Temperature Stress Rupture of a SiC/SiC Composite in Air

The crack density of woven Hi-Nicalon(sup TM) (Nippon Carbon, Japan) fiber, BN interphase, melt-infiltrated SiC matrix composites was determined for specimens subjected to tensile stress rupture at 815 C. A significant amount of matrix cracking occurs due to the growth of fiber-bridged microcracks even at stresses below the run-out condition. This increased cracking corresponded to time dependent strain accumulation and acoustic emission activity during the constant load test. However, the portion of the rupture specimens subjected to cooler temperatures (< 600 C than the hot section had significantly lower crack densities compared to the hotter regions. From the acoustic emission and time dependent strain data it can be inferred that most of the matrix crack growth occurred within the first few hours of the tensile rupture experiment. The crack growth was attributed to an interphase recession mechanism that is enhanced by the presence of a thin carbon layer between the fiber and the matrix as a result of the composite fabrication process. One important consequence of matrix crack growth at the lower stresses is poor retained strength at room temperature for specimens that did not fail.