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Meta-optics, the application of metasurfaces into optical systems, is seeingan accelerating development owing to advantages in size, weight and cost andthe ability to program optical functions beyond traditional refractive optics.The transition of meta-optics from the laboratory into applications is enabledby scalable production methods based on highly reproducible semiconductorprocess technology. Here, we introduce a novel method for fabrication ofdouble-sided metasurfaces through deep-UV lithography as a production-readymethod for achieving high-quality meta-optics. We achieve patterning of asilicon wafer on both sides with mutual alignment of around 25 $\mu$m based ontool accuracy, without requiring through-wafer alignment markers other than thewafer notch. A first novel application highlighting the benefits ofdouble-sided design is demonstrated in the form of a dual-band metalens withindependent control over focal lengths in mid- and long-wave infrared bands.Using multi-reticle stitching we demonstrate a 40 mm diameter, large-areametalens with excellent broadband imaging performance, showing partialcancelling of chromatic dispersion when used in a hybrid configuration with aBaF$_2$ refractive lens. Our work opens new avenues for infrared meta-opticsdesigns and double-side meta-optics fabrication through a production-readytechnique which can be directly translated into scalable technology forreal-world applications.

Production-ready double-side fabrication of dual-band infrared meta-optics using deep-UV lithography