Open AccessInfluence of Laminating and Sintering Condition on Permittivity and Shrinkage During LTCC Process
Publication year - 2007
Publication title -
so'seong ga'gong/soseong gagong
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2007.16.5.396
Subject(s) - lamination , sintering , materials science , permittivity , ceramic , fabrication , shrinkage , composite material , relative permittivity , dielectric , electronic engineering , optoelectronics , engineering , layer (electronics) , medicine , alternative medicine , pathology