Open AccessStudy on Low Temperature Bonding Technology for Optical PCB with Polymer Intermediate Layers
Author(s) -
Doo-Yeol Cha,
Jai-Hyuk Lee,
SungPil Chang
Publication year - 2010
Publication title -
jeon'gi jeonja jaeryo haghoe nonmunji/jeon-gi jeonja jaeryo hakoe nonmunji
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2010.23.1.029
Subject(s) - bonding strength , materials science , anodic bonding , composite material , polymer , direct bonding , thermocompression bonding , wire bonding , optoelectronics , electronic engineering , electrical engineering , silicon , engineering , layer (electronics) , chip