Open AccessFluxless ultrasonic soldering of SiC ceramics and Cu by Bi–Ag–Ti based solder
Author(s) -
Daniela Šuryová,
Igor Kostolný,
Roman Koleňák
Publication year - 2020
Publication title -
aims materials science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.367
H-Index - 16
eISSN - 2372-0484
pISSN - 2372-0468
DOI - 10.3934/matersci.2020.1.24
Subject(s) - soldering , materials science , ceramic , metallurgy , ultrasonic sensor , composite material , acoustics , physics