The Legal Issues of Joint Invention
Author(s) -
Seung Kun Kim,
Sun Jeong Kim
Publication year - 2015
Publication title -
the journal of intellectual property
Language(s) - English
Resource type - Journals
eISSN - 2733-8487
pISSN - 1975-5945
DOI - 10.34122/jip.2015.03.10.1.55
Subject(s) - joint (building) , computer science , engineering , architectural engineering
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