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Tensile tests on two kinds of electroplated copper foils with twins before and after annealing were performed. One electroplating parameter results in a microstructure of &lt;110&gt;-oriented microtwinned Cu (mt-Cu), and the other is &lt;111&gt;-oriented nanotwinned Cu (nt-Cu). The latter shows higher thermal stability than the former after annealing. Though the toughness for the two as-plated foils are quite close, the toughness for the &lt;111&gt; oriented nt-Cu increased from 34 to 74 MJ/m 3 after annealing at 250 °C for 3 h. In comparison, the toughness of the &lt;110&gt;-oriented mt-Cu remained almost the same after annealing.

Tensile Properties and Thermal Stability of Unidirectionally <111>-Oriented Nanotwinned and <110>-Oriented Microtwinned Copper