Open AccessThe effect of varied plasma etching parameters on adhesion of copper plating to ABS plastic
Author(s) -
Earl Steven Gurley
Publication year - 1992
Publication title -
san josé state university scholarworks (san jose state university)
Language(s) - English
Resource type - Dissertations/theses
DOI - 10.31979/etd.wwr2-pqfn
Subject(s) - copper , materials science , etching (microfabrication) , plating (geology) , plasma etching , adhesion , plasma , composite material , metallurgy , geology , physics , layer (electronics) , quantum mechanics , geophysics
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