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Penelitian Kemasan Kripik Singkong
Author(s) -
Susmirah Suryandari
Publication year - 2014
Publication title -
jurnal kimia dan kemasan/jurnal kimia dan kemasan
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2549-9424
pISSN - 2088-026X
DOI - 10.24817/jkk.v0i0.5140
Subject(s) - polypropylene , materials science , polyethylene , humidity , polystyrene , plastic packaging , composite material , moisture , pulp and paper industry , polymer , engineering , physics , thermodynamics

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