Penelitian Kemasan Kripik Singkong | Zendy

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Penelitian Kemasan Kripik Singkong

Author(s) -

Susmirah Suryandari

Publication year - 2014

Publication title -

jurnal kimia dan kemasan

Language(s) - Uncategorized

Resource type - Journals

eISSN - 2549-9424

pISSN - 2088-026X

DOI - 10.24817/jkk.v0i0.5140

Subject(s) - polypropylene , materials science , polyethylene , humidity , polystyrene , plastic packaging , composite material , moisture , pulp and paper industry , polymer , engineering , thermodynamics , physics

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