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We demonstrate a hermetically sealed packaging system for integrated photonicdevices at cryogenic temperatures with plug-and-play functionality. Thisapproach provides the ability to encapsulate a controlled amount of gas intothe optical package allowing helium to be used as a heat-exchange gas tothermalize photonic devices, or condensed into a superfluid covering thedevice. This packaging system was tested using a silicon-on-insulator slotwaveguide resonator which fills with superfluid $^4$He below the transitiontemperature. To optimize the fiber-to-chip optical integration 690 tests wereperformed by thermally cycling optical fibers bonded to various common photonicchip substrates (silicon, silicon oxide and HSQ) with a range of glues (NOA 61,NOA 68, NOA 88, NOA 86H and superglue). This showed that NOA 86H (a UV curingoptical adhesive with a latent heat catalyst) provided the best performanceunder cryogenic conditions for all the substrates tested. The technique isrelevant to superfluid optomechanics experiments, as well as quantum photonicsand quantum optomechanics applications.

Cryogenic and hermetically sealed packaging of photonic chips for optomechanics