Open AccessAtomic Migration of Cu in Ti/Ni/Cu/Ag Backside Metallization on Si Substrate
Author(s) -
Pei-Ing Lee,
PoChing Wu,
Tung-Han Chuang
Publication year - 2021
Publication title -
proceedings of the world congress on mechanical, chemical, and material engineering
Language(s) - English
Resource type - Conference proceedings
ISSN - 2369-8136
DOI - 10.11159/mmme21.120
Subject(s) - materials science , substrate (aquarium) , silicon , copper , optoelectronics , metallurgy , geology , oceanography