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Guest Editorial: Nanopackaging Part II
Author(s) -
Attila Bonyar,
Brajesh Kumar Kaushik,
James E. Morris,
Markondeyaraj Pulugurtha
Publication year - 2022
Publication title -
ieee open journal of nanotechnology
Language(s) - English
Resource type - Journals
ISSN - 2644-1292
DOI - 10.1109/ojnano.2022.3224652
Subject(s) - components, circuits, devices and systems , engineered materials, dielectrics and plasmas
The papers in this special section focus on nanopackaging. It begins with three reviews of diverse nanoscale technologies and then moves on to research papers focused primarily on nanomaterials for on-chip interconnect and noise abatement.

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