English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Tools annual

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Presents the access of premium content as premium feature

Premium Content

Global: Zendy Plus annual

Global: Zendy Free Plan

Being able to combine different materials allows taking advantage ofdifferent properties and device engineering that cannot be found or exploitedwithin a single material system. In quantum nano-photonics, one might want toincrease the device functionalities by, for instance, combining efficientclassical and quantum light emission available in III-V semiconductors,low-loss light propagation accessible in silicon-based materials, fastelectro-optical properties of lithium niobate and broadband reflectors and/orburied metallic contacts for local electric field application or electricalinjection of emitters. We propose a transfer printing technique based on theremoval of arrays of free-standing membranes and their deposition onto a hostmaterial using a thermal release adhesive tape-assisted process. This approachis versatile, in that it poses limited restrictions on the transferred and hostmaterials. In particular, we transfer 190 nm-thick GaAs membranes, withdimensions up to about 260$\mu$m x 80$\mu$m, containing InAs quantum dots, ontoa gold substrate. We show that the presence of a back reflector combined withthe etching of micro-pillars significantly increases the extraction efficiencyof quantum light, reaching photon fluxes, from a single quantum dot line,exceeding 8 x 10$^5$ photons per second, which is four times higher than thehighest count rates measured, on the same chip, from emitters outside thepillars. Given the versatility and the ease of the process, this techniqueopens the path to the realisation of hybrid quantum and nano-photonic devicesthat can combine virtually any material that can be undercut to realisefree-standing membranes that are then transferred onto any host substrate,without specific compatibility issues and/or requirements.

Thermal release tape-assisted semiconductor membrane transfer process for hybrid photonic devices embedding quantum emitters