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This study investigates the slicing capabilities and surface characteristics of Silicon wafer by optimizing the operation parameters of the Abrasive water jet machining process. Slicing carried out on single crystal pure silicon ingot in AWJM by using an abrasive particle of size 80 mesh. To optimize the AWJ operation parameters L9 Taguchi orthogonal array is used and compare the superficial feature like surface roughness, topography, and slicing rate using different input parameters like SOD, water jet pressure, and flow rate of abrasives. To know the significant slicing parameter, which impact in the surface finish of silicon wafer by ANOVA analysis and the empirical model of the slicing process is find by using a regression model, Further Fuzzy logic analysis used to predict the abrasive water jet machining process parameters with Mamdani fuzzy rules and Triangular membership function. SEM analysis is portrayed by the surface morphology of different mesh size machined on pure Si wafer.

Optimization of awj process using fuzzy taguchi method for improving surface characteristics of silicon wafer