English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

In preparation for the High Luminosity LHC (HL-LHC) runs,  the ATLAS inner detector will be completely replaced with an all  silicon Inner Tracker (ITk).  Hybrid silicon pixel modules will be  used for the innermost tracking layers, and silicon micro-strip  detectors will be used the outer layers of the tracker.  During the  production of the detector, the sensors, readout electronics, and  other components will undergo a series of quality control (QC) and  quality assurance tests.  Defects in the fabrication of the sensors  will be flagged early in the manufacturer's and ATLAS QC tests.  A  study of the influence of sensor defects was performed to assess the  characteristics of these defects in completed modules, and whether  any defect posed a risk to the operation of the front-end readout  electronics.  All defects were found to have no impact on the  performance of the front-end readout electronics for healthy  amplifier channels, and defects that short the coupling between the  strip implant and the metal readout electrode were only noticeable  for strip leakage currents in excess of 250 nA, beyond the  end-of-life currents expected for most sensors at the HL-LHC.

Silicon strip defects and their impact on electrical performance of readout electronics