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Temperature and pressure evolution due to heating and cooling in the range of 300 to 1100 K of Aluminum thin film with thickness 10 nm were investigated based on Molecular Dynamics (MD) simulation. Pressure evolution shows that heating and cooling rates with comparison of 3:2:1 provides significant contribution on melting and recrystallization of the system. The oscillation of the pressure is the strongest at the highest heating rate which indicate that the system collapses stronger than the lower rate. It is responsible for the destruction of the structure correlated to the elevation of the temperature. While for recrystallization, the analysis on pressure oscillations confirmed the influence of the rates. Analysis based on local crystal structure indicated that at T = 1100 K, all the systems are melted.

Influence of heating and cooling rates on thermodynamic properties of aluminum thin film from 300 to 1100 K